Hongbao
Solder joint inspection
Project Background
During the soldering process, defects may occur in PCB solder joints (hereinafter referred to as solder joints) due to various reasons. If these circuit boards are used in electronic products, it may lead to various problems in the later stage of electronic products, resulting in significant losses, or even the scrapping of the entire electronic product. Therefore, it is crucial to ensure the normal operation of each solder joint. Using a machine vision inspection system can accurately detect whether the solder joint is qualified.
Types of Solder Joint Defects
Excess solder: The shape of the solder joint is approximately spherical. Due to the excessive amount of solder, there is no obvious gap between it and the adjacent solder joints;
Insufficient solder: The amount of solder at the pin or sucker is insufficient, and the bottom shape is flatter compared to a qualified solder joint;
Cold solder joint: The solder joint is asymmetrical, and the solder tilts to one side. There are usually holes in the solder ball, and local sharp points;
Poor solder joint: The solder is not fully plated on the surface of the solder joint, and the solder joint is not fixed by the solder;
Void: The pin does not hold the solder, resulting in voids around the pin and PCB moisture;
Sharp point: The solder joint has obvious sharp points at the top or bottom, and part of the solder is missing, with more spherical sharp points.
Project Requirements
1. Detect if the solder joint is OK.
2. Detect if the fixing screws are OK.
Solution Process
1. Solder joint missing detection: Based on the characteristic part of the solder joint that is not covered by solder, detection is performed. If the characteristic part is detected, it is considered a missing solder joint.
2. Determine the quality rate of solder joints and screws through blob analysis and defect contour matching.
Partial Imaging Results
Defective Products
不良品
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